scholarship 2

Asian Development Bank (ADB) – Japan Scholarship Program (JSP) 2023

The ADB-Japan Scholarship Program (JSP) offers about 135 graduate scholarships a year for studies in economics, business and management, science and technology, and other development-related fields.

Eligibility :

  • Applicant must be a national of an ADB borrowing member country and Japanese ODA scholarship-eligible country and should not hold dual citizenship of any developed country.
  • Candidate must have gained admission to an approved master’s course at a Designated Institution.
  • Students must hold a bachelor’s degree or its equivalent with superior academic record.
  • Applicants should have at least two (2) years of full-time professional working experience (acquired after a university degree) at the time of application. The candidate must have proficiency in oral and written English communication skills to be able to pursue studies.
  • Candidates should not be more than 35 years old at the time of application unless waived in exceptional cases with the expressed endorsement of the Government of Japan.
  • Applicants must be in good health and agree to return and work in his/her home country for at least two (2) years after completion of studies under the Program in order to contribute to its development.

Eligible countries:

Afghanistan, Armenia, Azerbaijan, Bangladesh, Bhutan, Brunei Darussalam, Cambodia, Cook Islands, People’s Republic of China, Georgia, India, Indonesia, Fiji, Hong Kong, China, Kazakhstan, Kiribati, the Republic of Korea, Kyrgyz Republic, Lao People’s Democratic Republic, Malaysia, Maldives, Marshall Islands, Federated States of Micronesia, Mongolia, Myanmar, Nauru, Nepal, Pakistan, Palau, Papua New Guinea, Philippines, Samoa, Singapore, Solomon Islands, Sri Lanka, Taipei, China, Tajikistan, Thailand, Timor-Leste, Tonga, Turkmenistan, Tuvalu, Uzbekistan, Vanuatu, Vietnam.

Benefits:

  • Full tuition fees
  • A monthly subsistence and housing allowance
  • An allowance for books and instructional materials
  • Medical insurance
  • Travel expenses

To Apply : Click here to apply for this scholarship program

 

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